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    • Wakefield Thermal
  • Solutions
    • - Data Center Hot Spot Elimination and Localized Cooling
    • - Energy Efficiency and Space Optimization
    • - Thermal solutions for Enterprise Data Centers
    • - Partner Solutions Overview
  • Products
    • - Heat Exchangers
      • - - RDHx – Low Density
      • - - RDHx – Standard Density
      • - - RDHx – High and Ultra Density
      • - - RDHx – Active Door
    • - Coolant Distribution Units
    • - External Manifolds
    • - Hose Kits
    • - Accessories
  • Services
    • - Installation and Commissioning
    • - Preventative Maintenance
    • - On-Site Services
    • - Warranties
  • About
    • - Careers
    • - Contact Page
    • - Member Organizations
    • - Privacy Policy
      • - - Legal and Copyright
    • - Wakefield Thermal

White Papers

George Washington University

George Washington University

National Oceanic and Atmospheric Administration

NOAA Case Study

Sun Microsystems

Sun MicroSystems

Clemson University

Clemson University

Perdue Reference Letter

Perdue University Case Study

Lawerence Berkeley National Labs

Lawerence Berkley National Labs

 

 

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